MRF21010SR1
vs
MRF6S20010NR1
feature comparison
Part Life Cycle Code |
Transferred
|
Obsolete
|
Ihs Manufacturer |
MOTOROLA INC
|
NXP SEMICONDUCTORS
|
Package Description |
FLATPACK, R-CDFP-F2
|
ROHS COMPLIANT, PLASTIC, CASE 1265-09, 2 PIN
|
Pin Count |
3
|
|
Manufacturer Package Code |
CASE 360C-05
|
|
Reach Compliance Code |
unknown
|
not_compliant
|
ECCN Code |
EAR99
|
EAR99
|
Case Connection |
SOURCE
|
SOURCE
|
Configuration |
SINGLE
|
SINGLE
|
DS Breakdown Voltage-Min |
65 V
|
68 V
|
FET Technology |
METAL-OXIDE SEMICONDUCTOR
|
METAL-OXIDE SEMICONDUCTOR
|
Highest Frequency Band |
S BAND
|
S BAND
|
JESD-30 Code |
R-CDFP-F2
|
R-PDFM-F2
|
Number of Elements |
1
|
1
|
Number of Terminals |
2
|
2
|
Operating Mode |
ENHANCEMENT MODE
|
ENHANCEMENT MODE
|
Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
PLASTIC/EPOXY
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
FLATPACK
|
FLANGE MOUNT
|
Polarity/Channel Type |
N-CHANNEL
|
N-CHANNEL
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Surface Mount |
YES
|
YES
|
Terminal Form |
FLAT
|
FLAT
|
Terminal Position |
DUAL
|
DUAL
|
Transistor Application |
AMPLIFIER
|
AMPLIFIER
|
Transistor Element Material |
SILICON
|
SILICON
|
Base Number Matches |
1
|
1
|
Rohs Code |
|
Yes
|
HTS Code |
|
8541.29.00
|
Factory Lead Time |
|
2 Days
|
Samacsys Manufacturer |
|
NXP
|
JEDEC-95 Code |
|
TO-270AA
|
JESD-609 Code |
|
e3
|
Moisture Sensitivity Level |
|
3
|
Operating Temperature-Max |
|
225 °C
|
Peak Reflow Temperature (Cel) |
|
260
|
Terminal Finish |
|
TIN
|
Time@Peak Reflow Temperature-Max (s) |
|
40
|
|
|
|
Compare MRF21010SR1 with alternatives
Compare MRF6S20010NR1 with alternatives