MRF10150 vs MX0912B251Y,114 feature comparison

MRF10150 TE Connectivity

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MX0912B251Y,114 NXP Semiconductors

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Rohs Code Yes
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer TE CONNECTIVITY LTD NXP SEMICONDUCTORS
Package Description , METAL CERAMIC PACKAGE-2
Pin Count 2 2
Manufacturer Package Code CASE 376B-02 SOT439A
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
Collector Current-Max (IC) 14 A
Configuration SINGLE SINGLE
DC Current Gain-Min (hFE) 20
Number of Elements 1 1
Operating Temperature-Max 200 °C 200 °C
Polarity/Channel Type NPN NPN
Power Dissipation-Max (Abs) 700 W
Base Number Matches 4 1
Part Package Code DFM
HTS Code 8541.29.00.75
Additional Feature DIFFUSED EMITTER BALLASTING RESISTORS
Case Connection BASE
Collector-Emitter Voltage-Max 20 V
Highest Frequency Band L BAND
JESD-30 Code R-CDFM-F2
Number of Terminals 2
Package Body Material CERAMIC, METAL-SEALED COFIRED
Package Shape RECTANGULAR
Package Style FLANGE MOUNT
Qualification Status Not Qualified
Surface Mount YES
Terminal Form FLAT
Terminal Position DUAL
Transistor Application AMPLIFIER
Transistor Element Material SILICON

Compare MRF10150 with alternatives

Compare MX0912B251Y,114 with alternatives