MRF10150
vs
MX0912B251Y,114
feature comparison
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Transferred
|
Obsolete
|
Ihs Manufacturer |
TE CONNECTIVITY LTD
|
NXP SEMICONDUCTORS
|
Package Description |
,
|
METAL CERAMIC PACKAGE-2
|
Pin Count |
2
|
2
|
Manufacturer Package Code |
CASE 376B-02
|
SOT439A
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
Collector Current-Max (IC) |
14 A
|
|
Configuration |
SINGLE
|
SINGLE
|
DC Current Gain-Min (hFE) |
20
|
|
Number of Elements |
1
|
1
|
Operating Temperature-Max |
200 °C
|
200 °C
|
Polarity/Channel Type |
NPN
|
NPN
|
Power Dissipation-Max (Abs) |
700 W
|
|
Base Number Matches |
4
|
1
|
Part Package Code |
|
DFM
|
HTS Code |
|
8541.29.00.75
|
Additional Feature |
|
DIFFUSED EMITTER BALLASTING RESISTORS
|
Case Connection |
|
BASE
|
Collector-Emitter Voltage-Max |
|
20 V
|
Highest Frequency Band |
|
L BAND
|
JESD-30 Code |
|
R-CDFM-F2
|
Number of Terminals |
|
2
|
Package Body Material |
|
CERAMIC, METAL-SEALED COFIRED
|
Package Shape |
|
RECTANGULAR
|
Package Style |
|
FLANGE MOUNT
|
Qualification Status |
|
Not Qualified
|
Surface Mount |
|
YES
|
Terminal Form |
|
FLAT
|
Terminal Position |
|
DUAL
|
Transistor Application |
|
AMPLIFIER
|
Transistor Element Material |
|
SILICON
|
|
|
|
Compare MRF10150 with alternatives
Compare MX0912B251Y,114 with alternatives