MR850
vs
BYX38-300R
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
MOTOROLA INC
PHILIPS COMPONENTS
Package Description
O-PALF-W2
O-MUPM-D1
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8541.10.00.80
8541.10.00.80
Additional Feature
FREE WHEELING DIODE
LEAKAGE CURRENT IS NOT AT 25 DEG C
Application
EFFICIENCY
POWER
Case Connection
ISOLATED
ANODE
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
RECTIFIER DIODE
RECTIFIER DIODE
Forward Voltage-Max (VF)
1.25 V
1.7 V
JESD-30 Code
O-PALF-W2
O-MUPM-D1
JESD-609 Code
e0
Non-rep Pk Forward Current-Max
100 A
50 A
Number of Elements
1
1
Number of Phases
1
1
Number of Terminals
2
1
Operating Temperature-Max
125 °C
150 °C
Operating Temperature-Min
-65 °C
Output Current-Max
3 A
6 A
Package Body Material
PLASTIC/EPOXY
METAL
Package Shape
ROUND
ROUND
Package Style
LONG FORM
POST/STUD MOUNT
Qualification Status
Not Qualified
Not Qualified
Rep Pk Reverse Voltage-Max
50 V
300 V
Reverse Current-Max
10 µA
200 µA
Reverse Recovery Time-Max
0.3 µs
Surface Mount
NO
NO
Terminal Finish
Tin/Lead (Sn/Pb)
Terminal Form
WIRE
SOLDER LUG
Terminal Position
AXIAL
UPPER
Base Number Matches
2
1
Reference Standard
CECC50009-019
Compare MR850 with alternatives
Compare BYX38-300R with alternatives