MR850 vs BYX38-300R feature comparison

MR850 Motorola Mobility LLC

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BYX38-300R YAGEO Corporation

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Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer MOTOROLA INC PHILIPS COMPONENTS
Package Description O-PALF-W2 O-MUPM-D1
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.80 8541.10.00.80
Additional Feature FREE WHEELING DIODE LEAKAGE CURRENT IS NOT AT 25 DEG C
Application EFFICIENCY POWER
Case Connection ISOLATED ANODE
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type RECTIFIER DIODE RECTIFIER DIODE
Forward Voltage-Max (VF) 1.25 V 1.7 V
JESD-30 Code O-PALF-W2 O-MUPM-D1
JESD-609 Code e0
Non-rep Pk Forward Current-Max 100 A 50 A
Number of Elements 1 1
Number of Phases 1 1
Number of Terminals 2 1
Operating Temperature-Max 125 °C 150 °C
Operating Temperature-Min -65 °C
Output Current-Max 3 A 6 A
Package Body Material PLASTIC/EPOXY METAL
Package Shape ROUND ROUND
Package Style LONG FORM POST/STUD MOUNT
Qualification Status Not Qualified Not Qualified
Rep Pk Reverse Voltage-Max 50 V 300 V
Reverse Current-Max 10 µA 200 µA
Reverse Recovery Time-Max 0.3 µs
Surface Mount NO NO
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form WIRE SOLDER LUG
Terminal Position AXIAL UPPER
Base Number Matches 2 1
Reference Standard CECC50009-019

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