MR82C237/B
vs
KS82C37A-10IP
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
INTERSIL CORP
|
SAMSUNG SEMICONDUCTOR INC
|
| Part Package Code |
LCC
|
DIP
|
| Package Description |
CERAMIC, LCC-44
|
DIP, DIP40,.6
|
| Pin Count |
44
|
40
|
| Reach Compliance Code |
not_compliant
|
compliant
|
| ECCN Code |
3A001.A.2.C
|
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Address Bus Width |
8
|
8
|
| Bus Compatibility |
80C286; 80286; 80186; 80C86; 8086; 80C88; 8088; 8085; Z80; NSC800
|
8080; 8085; 8086; 8088; 80186; 80286; 80386
|
| Clock Frequency-Max |
8 MHz
|
10 MHz
|
| External Data Bus Width |
8
|
8
|
| JESD-30 Code |
S-CQCC-N44
|
R-PDIP-T40
|
| JESD-609 Code |
e0
|
e0
|
| Length |
16.535 mm
|
52.197 mm
|
| Number of DMA Channels |
4
|
4
|
| Number of Terminals |
44
|
40
|
| Operating Temperature-Max |
125 °C
|
85 °C
|
| Operating Temperature-Min |
-55 °C
|
-40 °C
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
PLASTIC/EPOXY
|
| Package Code |
QCCN
|
DIP
|
| Package Equivalence Code |
LCC44,.65SQ
|
DIP40,.6
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER
|
IN-LINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Screening Level |
38535Q/M;38534H;883B
|
|
| Seated Height-Max |
3.05 mm
|
5.08 mm
|
| Supply Current-Max |
16 mA
|
20 mA
|
| Supply Voltage-Max |
5.5 V
|
6 V
|
| Supply Voltage-Min |
4.5 V
|
4 V
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
MILITARY
|
INDUSTRIAL
|
| Terminal Finish |
TIN LEAD
|
TIN LEAD
|
| Terminal Form |
NO LEAD
|
THROUGH-HOLE
|
| Terminal Pitch |
1.27 mm
|
2.54 mm
|
| Terminal Position |
QUAD
|
DUAL
|
| Width |
16.535 mm
|
15.24 mm
|
| uPs/uCs/Peripheral ICs Type |
DMA CONTROLLER
|
DMA CONTROLLER
|
| Base Number Matches |
2
|
1
|
| Pbfree Code |
|
No
|
|
|
|
Compare MR82C237/B with alternatives
Compare KS82C37A-10IP with alternatives