MR53V1652J-XXRA
vs
K3N5V1000F-DC100
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
LAPIS SEMICONDUCTOR CO LTD
SAMSUNG SEMICONDUCTOR INC
Part Package Code
DIP
DIP
Package Description
DIP, DIP42,.6
DIP,
Pin Count
42
42
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.71
8542.32.00.71
Access Time-Max
120 ns
100 ns
Alternate Memory Width
8
8
JESD-30 Code
R-PDIP-T42
R-PDIP-T42
Memory Density
4194304 bit
16777216 bit
Memory IC Type
MASK ROM
MASK ROM
Memory Width
8
16
Number of Functions
1
1
Number of Terminals
42
42
Number of Words
1048576 words
1048576 words
Number of Words Code
1000000
1000000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
512KX8
1MX16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Equivalence Code
DIP42,.6
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Standby Current-Max
0.00001 A
Supply Current-Max
0.02 mA
0.04 mA
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Base Number Matches
1
1
Rohs Code
Category CO2 Kg
12
Compliance Temperature Grade
Commercial: +0C to +70C
Candidate List Date
2011-06-20
Length
52.42 mm
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Seated Height-Max
5.08 mm
Supply Voltage-Max (Vsup)
3.6 V
Supply Voltage-Min (Vsup)
3 V
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
15.24 mm
Compare MR53V1652J-XXRA with alternatives
Compare K3N5V1000F-DC100 with alternatives