MR53V1602J-XXTP vs KM23V16000DG-10 feature comparison

MR53V1602J-XXTP LAPIS Semiconductor Co Ltd

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KM23V16000DG-10 Samsung Semiconductor

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer LAPIS SEMICONDUCTOR CO LTD SAMSUNG SEMICONDUCTOR INC
Part Package Code TSOP2 SOIC
Package Description SOP, TSOP44,.46,32 SOP, SOP44,.63
Pin Count 44 44
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 100 ns 100 ns
Alternate Memory Width 8 8
JESD-30 Code R-PDSO-G44 R-PDSO-G44
Memory Density 16777216 bit 16777216 bit
Memory IC Type MASK ROM MASK ROM
Memory Width 16 16
Number of Functions 1 1
Number of Terminals 44 44
Number of Words 1048576 words 1048576 words
Number of Words Code 1000000 1000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 1MX16 1MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Equivalence Code TSOP44,.46,32 SOP44,.63
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Standby Current-Max 0.001 A 0.00003 A
Supply Current-Max 0.04 mA 0.04 mA
Supply Voltage-Max (Vsup) 3.6 V 3.3 V
Supply Voltage-Min (Vsup) 2.7 V 2.7 V
Supply Voltage-Nom (Vsup) 3.3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Form GULL WING GULL WING
Terminal Pitch 0.8 mm 1.27 mm
Terminal Position DUAL DUAL
Base Number Matches 2 1
Rohs Code No
Additional Feature IT CAN ALSO OPERATE AT 3.3V VCC
JESD-609 Code e0
Length 28.5 mm
Seated Height-Max 3.1 mm
Terminal Finish TIN LEAD
Width 12.6 mm

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