MR27V852DRA vs MR27V852E-XXXRA feature comparison

MR27V852DRA LAPIS Semiconductor Co Ltd

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MR27V852E-XXXRA LAPIS Semiconductor Co Ltd

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer LAPIS SEMICONDUCTOR CO LTD LAPIS SEMICONDUCTOR CO LTD
Part Package Code DIP DIP
Package Description DIP, DIP42,.6 DIP, DIP42,.6
Pin Count 42 42
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 100 ns 100 ns
Alternate Memory Width 8 8
I/O Type COMMON
JESD-30 Code R-PDIP-T42 R-PDIP-T42
JESD-609 Code e0 e0
Length 52 mm 51.98 mm
Memory Density 8388608 bit 8388608 bit
Memory IC Type OTP ROM MASK ROM
Memory Width 16 16
Number of Functions 1 1
Number of Terminals 42 42
Number of Words 524288 words 524288 words
Number of Words Code 512000 512000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 512KX16 512KX16
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP42,.6 DIP42,.6
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.15 mm 5.08 mm
Standby Current-Max 0.00005 A 0.00005 A
Supply Current-Max 0.08 mA 0.08 mA
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 15.24 mm 15.24 mm
Base Number Matches 2 2

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