MR12W1374FGL vs RK73H2BXTD1374F feature comparison

MR12W1374FGL Walsin Technology Corporation

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RK73H2BXTD1374F KOA Speer Electronics Inc

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Rohs Code Yes Yes
Part Life Cycle Code Active Active
Ihs Manufacturer WALSIN TECHNOLOGY CORP KOA SPEER ELECTRONICS INC
Package Description CHIP CHIP
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8533.21.00.30 8533.21.00.30
Additional Feature ANTI-SULFUR, RATED AC VOLTAGE (V): 200 PRECISION
Construction Chip Chip
JESD-609 Code e3
Mounting Feature SURFACE MOUNT SURFACE MOUNT
Number of Terminals 2 2
Operating Temperature-Max 155 °C 155 °C
Operating Temperature-Min -55 °C -55 °C
Package Height 0.6 mm 0.6 mm
Package Length 3.1 mm 3.2 mm
Package Style SMT SMT
Package Width 1.6 mm 1.6 mm
Packing Method TR, PAPER, 13 INCH TR, PUNCHED PAPER, 7 INCH
Rated Power Dissipation (P) 0.25 W 0.25 W
Rated Temperature 70 °C 70 °C
Reference Standard AEC-Q200; MIL-STD-202 MIL-R-55342F
Resistance 1370000 Ω 1370000 Ω
Resistor Type FIXED RESISTOR FIXED RESISTOR
Size Code 1206 1206
Surface Mount YES YES
Technology METAL GLAZE/THICK FILM METAL GLAZE/THICK FILM
Temperature Coefficient 200 ppm/°C 200 ppm/°C
Terminal Finish TIN
Terminal Shape WRAPAROUND WRAPAROUND
Tolerance 1% 1%
Working Voltage 200 V 200 V
Base Number Matches 1 1
Package Shape RECTANGULAR PACKAGE

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