MR0A08BCMA35 vs MR0A08BMMA35 feature comparison

MR0A08BCMA35 Everspin Technologies

Buy Now Datasheet

MR0A08BMMA35 Everspin Technologies

Buy Now Datasheet
Rohs Code Yes Yes
Part Life Cycle Code Active Obsolete
Ihs Manufacturer EVERSPIN TECHNOLOGIES INC EVERSPIN TECHNOLOGIES INC
Part Package Code BGA BGA
Package Description LFBGA, BGA48,6X8,30 LFBGA,
Pin Count 48 48
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Samacsys Manufacturer Everspin Technologies
Access Time-Max 35 ns
JESD-30 Code S-PBGA-B48 S-PBGA-B48
Length 8 mm 8 mm
Memory Density 1048576 bit 1024 bit
Memory IC Type MEMORY CIRCUIT MEMORY CIRCUIT
Memory Width 8 8
Moisture Sensitivity Level 3 3
Number of Functions 1 1
Number of Terminals 48 48
Number of Words 131072 words 128 words
Number of Words Code 128000 128
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Organization 128KX8 128X8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFBGA LFBGA
Package Equivalence Code BGA48,6X8,30
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.35 mm 1.35 mm
Standby Current-Max 0.007 A
Supply Current-Max 0.07 mA
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL AUTOMOTIVE
Terminal Form BALL BALL
Terminal Pitch 0.75 mm 0.75 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 8 mm 8 mm
Base Number Matches 2 1

Compare MR0A08BCMA35 with alternatives

Compare MR0A08BMMA35 with alternatives