MQ5809AUS
vs
JANS1N5809URS
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
MICROSEMI CORP
MICROCHIP TECHNOLOGY INC
Package Description
O-LELF-R2
HERMETIC SEALED, GLASS, MELF-2
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
HTS Code
8541.10.00.80
Additional Feature
HIGH RELIABILITY
HIGH RELIABILITY, METALLURGICALLY BONDED
Application
ULTRA FAST RECOVERY
ULTRA FAST RECOVERY
Case Connection
ISOLATED
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
RECTIFIER DIODE
RECTIFIER DIODE
Forward Voltage-Max (VF)
0.925 V
JESD-30 Code
O-LELF-R2
O-LELF-R2
JESD-609 Code
e0
Non-rep Pk Forward Current-Max
125 A
125 A
Number of Elements
1
1
Number of Phases
1
1
Number of Terminals
2
2
Operating Temperature-Max
175 °C
175 °C
Operating Temperature-Min
-65 °C
-65 °C
Output Current-Max
3 A
3 A
Package Body Material
GLASS
GLASS
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Reference Standard
MIL-19500
MIL-19500
Rep Pk Reverse Voltage-Max
100 V
100 V
Reverse Current-Max
5 µA
Reverse Recovery Time-Max
0.04 µs
0.03 µs
Surface Mount
YES
YES
Terminal Finish
TIN LEAD
Terminal Form
WRAP AROUND
WRAP AROUND
Terminal Position
END
END
Base Number Matches
1
4
Factory Lead Time
39 Weeks
Qualification Status
Qualified
Compare MQ5809AUS with alternatives
Compare JANS1N5809URS with alternatives