MPX2300DT1
vs
MPX2300DT1
feature comparison
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
MOTOROLA INC
|
NXP SEMICONDUCTORS
|
| Reach Compliance Code |
unknown
|
compliant
|
| Accuracy-Max (%) |
3%
|
3%
|
| Body Breadth |
3.68 mm
|
3.68 mm
|
| Body Height |
9.14 mm
|
9.14 mm
|
| Body Length or Diameter |
6.35 mm
|
6.35 mm
|
| JESD-609 Code |
e0
|
|
| Linearity (%) |
1.5 %
|
1.5 %
|
| Mounting Feature |
THROUGH HOLE MOUNT
|
THROUGH HOLE MOUNT
|
| Offset-Nom |
0MV
|
0MV
|
| Operating Current-Max |
1 mA
|
1 mA
|
| Operating Temperature-Max |
40 °C
|
40 °C
|
| Operating Temperature-Min |
15 °C
|
15 °C
|
| Output Range |
0-3mV
|
0.75-3.78mV
|
| Output Type |
ANALOG VOLTAGE
|
ANALOG VOLTAGE
|
| Package Shape/Style |
RECTANGULAR
|
RECTANGULAR
|
| Pressure Range-Max |
5.8 Psi
|
5.8 Psi
|
| Pressure Range-Min |
|
|
| Pressure Sensing Mode |
DIFFERENTIAL
|
DIFFERENTIAL
|
| Response Time |
1000 µs
|
1000 µs
|
| Sensors/Transducers Type |
PRESSURE SENSOR,PIEZORESISTIVE
|
PRESSURE SENSOR,PIEZORESISTIVE
|
| Supply Voltage-Max |
10 V
|
10 V
|
| Supply Voltage-Min |
6 V
|
6 V
|
| Surface Mount |
NO
|
NO
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
|
| Termination Type |
SOLDER
|
SOLDER
|
| Base Number Matches |
1
|
1
|
| Rohs Code |
|
Yes
|
| Package Description |
|
CHIP PAK-4
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8542.39.00.01
|
| Factory Lead Time |
|
52 Weeks
|
| Samacsys Manufacturer |
|
NXP
|
| Additional Feature |
|
SENSITIVITY 5 MICRO VOLT PER VOLT PER MMHG, TEMPERATURE COMPENSATED
|
| Port Type |
|
HOLE
|
|
|
|
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