MPIC2111DR1
vs
LM2722M/NOPB
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MOTOROLA INC
NATIONAL SEMICONDUCTOR CORP
Part Package Code
SOIC
SOIC
Package Description
SOP,
SOP, SOP8,.25
Pin Count
8
8
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Additional Feature
FLOATING LOAD DRIVER; UNDER VOLTAGE LOCKOUT CIRCUIT
High Side Driver
YES
YES
Interface IC Type
HALF BRIDGE BASED MOSFET DRIVER
HALF BRIDGE BASED MOSFET DRIVER
JESD-30 Code
R-PDSO-G8
R-PDSO-G8
Number of Functions
1
1
Number of Terminals
8
8
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Peak Current Limit-Nom
0.25 A
3.2 A
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
SOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Max
20 V
7 V
Supply Voltage-Min
10 V
4 V
Supply Voltage-Nom
15 V
5 V
Surface Mount
YES
YES
Technology
BICMOS
CMOS
Temperature Grade
AUTOMOTIVE
AUTOMOTIVE
Terminal Form
GULL WING
GULL WING
Terminal Position
DUAL
DUAL
Base Number Matches
1
1
Pbfree Code
Rohs Code
JESD-609 Code
e3
Length
4.9 mm
Moisture Sensitivity Level
1
Package Equivalence Code
SOP8,.25
Peak Reflow Temperature (Cel)
260
Seated Height-Max
1.75 mm
Terminal Finish
Matte Tin (Sn)
Terminal Pitch
1.27 mm
Time@Peak Reflow Temperature-Max (s)
40
Width
3.9 mm
Compare MPIC2111DR1 with alternatives
Compare LM2722M/NOPB with alternatives