MPC885ZP66
vs
MPC860DECZQ50D4
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
MOTOROLA INC
FREESCALE SEMICONDUCTOR INC
Part Package Code
BGA
BGA
Package Description
BGA,
25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357
Pin Count
357
357
Reach Compliance Code
unknown
not_compliant
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
32
32
Bit Size
32
32
Boundary Scan
YES
YES
External Data Bus Width
32
32
Format
FIXED POINT
FIXED POINT
Integrated Cache
YES
YES
JESD-30 Code
S-PBGA-B357
S-PBGA-B357
Length
25 mm
25 mm
Low Power Mode
YES
YES
Number of Terminals
357
357
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.52 mm
2.52 mm
Speed
66 MHz
50 MHz
Supply Voltage-Max
1.9 V
3.465 V
Supply Voltage-Min
1.7 V
3.135 V
Supply Voltage-Nom
1.8 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Terminal Form
BALL
BALL
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
BOTTOM
BOTTOM
Width
25 mm
25 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
MICROPROCESSOR, RISC
Base Number Matches
1
2
Pbfree Code
Rohs Code
ECCN Code
3A991.A.2
Clock Frequency-Max
50 MHz
JESD-609 Code
e0
Moisture Sensitivity Level
3
Operating Temperature-Min
-40 °C
Package Equivalence Code
BGA357,19X19,50
Peak Reflow Temperature (Cel)
245
Terminal Finish
Tin/Lead (Sn/Pb)
Time@Peak Reflow Temperature-Max (s)
30
Compare MPC885ZP66 with alternatives
Compare MPC860DECZQ50D4 with alternatives