MPC885ZP66
vs
TS(X)PC860MHMZP50B
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
ATMEL GRENOBLE
Package Description
PLASTIC, BGA-357
,
Reach Compliance Code
unknown
unknown
ECCN Code
5A002.A.1
HTS Code
8542.31.00.01
Factory Lead Time
4 Weeks
Address Bus Width
32
32
Bit Size
32
32
Boundary Scan
YES
YES
External Data Bus Width
32
32
Format
FIXED POINT
FIXED POINT
Integrated Cache
YES
YES
JESD-30 Code
S-PBGA-B357
S-PBGA-B357
JESD-609 Code
e0
Length
25 mm
Low Power Mode
YES
NO
Moisture Sensitivity Level
3
Number of Terminals
357
357
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
Package Equivalence Code
BGA357,19X19,50
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Peak Reflow Temperature (Cel)
245
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.52 mm
Speed
66 MHz
50 MHz
Supply Voltage-Max
1.9 V
3.465 V
Supply Voltage-Min
1.7 V
3.135 V
Supply Voltage-Nom
1.8 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
Terminal Finish
Tin/Lead (Sn/Pb)
Terminal Form
BALL
BALL
Terminal Pitch
1.27 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
Width
25 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
MICROPROCESSOR, RISC
Base Number Matches
4
2
Part Package Code
BGA
Pin Count
357
Clock Frequency-Max
50 MHz
Operating Temperature-Max
125 °C
Operating Temperature-Min
-55 °C
Temperature Grade
MILITARY
Compare MPC885ZP66 with alternatives
Compare TS(X)PC860MHMZP50B with alternatives