Findchips: Compare MPC885VR66 vs KMPC885CZP66

MPC885VR66 vs KMPC885CZP66 feature comparison

Buy Now Datasheet

Buy Now Datasheet

Pbfree Code	Yes
Rohs Code	Yes	No
Part Life Cycle Code	Transferred	Transferred
Ihs Manufacturer	FREESCALE SEMICONDUCTOR INC	FREESCALE SEMICONDUCTOR INC
Part Package Code	BGA	BGA
Package Description	LEAD FREE, PLASTIC, BGA-357	BGA, BGA357,19X19,50
Pin Count	357	357
Reach Compliance Code	compliant	not_compliant
ECCN Code	5A002	5A002
HTS Code	8542.31.00.01	8542.31.00.01
Address Bus Width	32	32
Bit Size	32	32
Boundary Scan	YES	YES
External Data Bus Width	32	32
Format	FIXED POINT	FIXED POINT
Integrated Cache	YES	YES
JESD-30 Code	S-PBGA-B357	S-PBGA-B357
JESD-609 Code	e1	e0
Length	25 mm	25 mm
Low Power Mode	YES	YES
Moisture Sensitivity Level	3	3
Number of Terminals	357	357
Package Body Material	PLASTIC/EPOXY	PLASTIC/EPOXY
Package Code	BGA	BGA
Package Equivalence Code	BGA357,19X19,50	BGA357,19X19,50
Package Shape	SQUARE	SQUARE
Package Style	GRID ARRAY	GRID ARRAY
Peak Reflow Temperature (Cel)	260	245
Qualification Status	Not Qualified	Not Qualified
Seated Height-Max	2.52 mm	2.52 mm
Speed	66 MHz	66 MHz
Supply Voltage-Max	1.9 V	1.9 V
Supply Voltage-Min	1.7 V	1.7 V
Supply Voltage-Nom	1.8 V	1.8 V
Surface Mount	YES	YES
Technology	CMOS	CMOS
Terminal Finish	TIN SILVER COPPER	Tin/Lead (Sn/Pb)
Terminal Form	BALL	BALL
Terminal Pitch	1.27 mm	1.27 mm
Terminal Position	BOTTOM	BOTTOM
Time@Peak Reflow Temperature-Max (s)	40	30
Width	25 mm	25 mm
uPs/uCs/Peripheral ICs Type	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC
Base Number Matches	3	2
	Microcontrollers and Processors » Microprocessors	Microcontrollers and Processors » Microprocessors