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MPC885VR66 vs KMPC880CVR66 feature comparison

MPC885VR66 NXP Semiconductors

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KMPC880CVR66 Freescale Semiconductor

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Rohs Code Yes Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS FREESCALE SEMICONDUCTOR INC
Package Description LEAD FREE, PLASTIC, BGA-357 LEAD FREE, PLASTIC, BGA-357
Reach Compliance Code compliant compliant
ECCN Code 5A002.A.1 5A992
HTS Code 8542.31.00.01 8542.31.00.01
Factory Lead Time 4 Weeks
Samacsys Description End of Life - PowerQUICC, 32 Bit Power Architecture, 66MHz, Communications Processor, 0 to 95CPackage:BGA357, plastic, ball grid array; 357 balls; 1.27 mm pitch; 25 mm x 25 mm x 2.52 mm bodyProduct:Our PowerQUICC architecture containing a core built on Power Architrecture technology provides an exceptional combination of price, performance and functionality for networking and communications applications. The MPC885 family of processors are engineered to deliver on-chip security, dual Fast Ethernet (MII and
Samacsys Manufacturer NXP
Samacsys Modified On 2024-11-04 11:13:01
Category CO2 Kg 12.2
EU RoHS Version RoHS 2 (2015/863/EU)
Candidate List Date 2020-01-16
EFUP e
Conflict Mineral Status DRC Conflict Free
Conflict Mineral Status Source CMRT V5.11
Address Bus Width 32 32
Bit Size 32 32
Boundary Scan YES YES
External Data Bus Width 32 32
Format FIXED POINT FIXED POINT
Integrated Cache YES YES
JESD-30 Code S-PBGA-B357 S-PBGA-B357
JESD-609 Code e1 e1
Length 25 mm 25 mm
Low Power Mode YES YES
Moisture Sensitivity Level 3 3
Number of Terminals 357 357
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA357,19X19,50 BGA357,19X19,50
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 260 245
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.52 mm 2.52 mm
Speed 66 MHz 66 MHz
Supply Voltage-Max 1.9 V 1.9 V
Supply Voltage-Min 1.7 V 1.7 V
Supply Voltage-Nom 1.8 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu) TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 40 30
Width 25 mm 25 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 1 1
Part Package Code BGA
Pin Count 357
Microcontrollers and Processors » Microprocessors
Microcontrollers and Processors » Microprocessors

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Compare KMPC880CVR66 with alternatives