MPC875ZT66
vs
XPC823ECZT66B2
feature comparison
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
NXP SEMICONDUCTORS
|
FREESCALE SEMICONDUCTOR INC
|
Package Description |
PLASTIC, BGA-256
|
23 X 23 MM, 1.27 MM PITCH, PLASTIC, BGA-256
|
Reach Compliance Code |
unknown
|
not_compliant
|
ECCN Code |
5A002.A.1
|
3A991
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Factory Lead Time |
4 Weeks
|
|
Address Bus Width |
32
|
26
|
Bit Size |
32
|
32
|
Boundary Scan |
YES
|
YES
|
External Data Bus Width |
32
|
32
|
Format |
FIXED POINT
|
FIXED POINT
|
Integrated Cache |
YES
|
YES
|
JESD-30 Code |
S-PBGA-B256
|
S-PBGA-B256
|
JESD-609 Code |
e0
|
e0
|
Length |
23 mm
|
23 mm
|
Low Power Mode |
YES
|
YES
|
Moisture Sensitivity Level |
3
|
3
|
Number of Terminals |
256
|
256
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
HBGA
|
BGA
|
Package Equivalence Code |
BGA256,16X16,50
|
BGA256,23X23,50
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY, HEAT SINK/SLUG
|
GRID ARRAY
|
Peak Reflow Temperature (Cel) |
245
|
220
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
2.54 mm
|
2.35 mm
|
Speed |
66 MHz
|
66 MHz
|
Supply Voltage-Max |
1.9 V
|
3.6 V
|
Supply Voltage-Min |
1.7 V
|
3 V
|
Supply Voltage-Nom |
1.8 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Terminal Finish |
Tin/Lead (Sn/Pb)
|
Tin/Lead/Silver (Sn/Pb/Ag)
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Width |
23 mm
|
23 mm
|
uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
MICROPROCESSOR, RISC
|
Base Number Matches |
4
|
6
|
Part Package Code |
|
BGA
|
Pin Count |
|
256
|
Clock Frequency-Max |
|
5 MHz
|
Operating Temperature-Min |
|
-40 °C
|
|
|
|
Compare MPC875ZT66 with alternatives
Compare XPC823ECZT66B2 with alternatives