MPC875ZT66 vs MPC604ARS25 feature comparison

MPC875ZT66 Freescale Semiconductor

Buy Now Datasheet

MPC604ARS25 Motorola Mobility LLC

Buy Now Datasheet
Pbfree Code No
Rohs Code No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer FREESCALE SEMICONDUCTOR INC MOTOROLA INC
Part Package Code BGA BGA
Package Description PLASTIC, BGA-256 BGA,
Pin Count 256 256
Reach Compliance Code not_compliant unknown
ECCN Code 5A002
HTS Code 8542.31.00.01 8542.31.00.01
Address Bus Width 32 32
Bit Size 32 32
Boundary Scan YES YES
External Data Bus Width 32 64
Format FIXED POINT FLOATING POINT
Integrated Cache YES NO
JESD-30 Code S-PBGA-B256 S-CBGA-B256
JESD-609 Code e0
Length 23 mm 21 mm
Low Power Mode YES YES
Moisture Sensitivity Level 3
Number of Terminals 256 256
Package Body Material PLASTIC/EPOXY CERAMIC, METAL-SEALED COFIRED
Package Code HBGA BGA
Package Equivalence Code BGA256,16X16,50
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, HEAT SINK/SLUG GRID ARRAY
Peak Reflow Temperature (Cel) 245
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.54 mm 3.16 mm
Speed 66 MHz 25 MHz
Supply Voltage-Max 1.9 V 3.465 V
Supply Voltage-Min 1.7 V 3.135 V
Supply Voltage-Nom 1.8 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Width 23 mm 21 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 4 2
Additional Feature TWO 128 ENTRY TLB; TEMP SPECIFIED AS JUNCTION TEMP
Clock Frequency-Max 25 MHz
Number of DMA Channels
Number of External Interrupts 3
Number of Serial I/Os
On Chip Data RAM Width
Operating Temperature-Max 105 °C
Operating Temperature-Min
RAM (words) 0
Temperature Grade OTHER

Compare MPC875ZT66 with alternatives

Compare MPC604ARS25 with alternatives