MPC875ZT66
vs
MCF54415CMJ250
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
MOTOROLA INC
FREESCALE SEMICONDUCTOR INC
Package Description
23 X 23 MM, PLASTIC, BGA-256
12 X 12 MM, ROHS COMPLIANT, MAPBGA-256
Reach Compliance Code
unknown
compliant
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
32
Bit Size
32
32
Boundary Scan
YES
YES
External Data Bus Width
32
Format
FIXED POINT
FIXED POINT
Integrated Cache
YES
YES
JESD-30 Code
S-PBGA-B256
S-PBGA-B256
Length
23 mm
Low Power Mode
YES
YES
Number of Terminals
256
256
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA256,16X16,50
BGA256,16X16,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.54 mm
Speed
66.67 MHz
250 MHz
Supply Voltage-Max
1.9 V
1.32 V
Supply Voltage-Min
1.7 V
1.14 V
Supply Voltage-Nom
1.8 V
1.2 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Terminal Form
BALL
BALL
Terminal Pitch
1.27 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Width
23 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
MICROPROCESSOR
Base Number Matches
4
2
Pbfree Code
Part Package Code
BGA
Pin Count
256
ECCN Code
3A991.A.2
Clock Frequency-Max
100 MHz
JESD-609 Code
e2
Moisture Sensitivity Level
3
Operating Temperature-Max
85 °C
Operating Temperature-Min
-40 °C
Peak Reflow Temperature (Cel)
260
Temperature Grade
INDUSTRIAL
Time@Peak Reflow Temperature-Max (s)
40
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