Findchips: Compare MPC860PCZQ50D4 vs XPC860DECZP50D4

MPC860PCZQ50D4 vs XPC860DECZP50D4 feature comparison

Buy Now Datasheet

Buy Now Datasheet

Pbfree Code	No
Rohs Code	No
Part Life Cycle Code	Transferred	Transferred
Ihs Manufacturer	FREESCALE SEMICONDUCTOR INC	MOTOROLA INC
Part Package Code	BGA	BGA
Package Description	25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357	BGA, BGA357,19X19,50
Pin Count	357	357
Reach Compliance Code	not_compliant	unknown
ECCN Code	3A991.A.2	3A991.A.2
HTS Code	8542.31.00.01	8542.31.00.01
Address Bus Width	32
Bit Size	32
Boundary Scan	YES
Clock Frequency-Max	50 MHz
External Data Bus Width	32
Format	FIXED POINT
Integrated Cache	YES
JESD-30 Code	S-PBGA-B357	S-PBGA-B357
JESD-609 Code	e0
Length	25 mm	25 mm
Low Power Mode	YES
Moisture Sensitivity Level	3
Number of Terminals	357	357
Operating Temperature-Min	-40 °C	-40 °C
Package Body Material	PLASTIC/EPOXY	PLASTIC/EPOXY
Package Code	BGA	BGA
Package Equivalence Code	BGA357,19X19,50	BGA357,19X19,50
Package Shape	SQUARE	SQUARE
Package Style	GRID ARRAY	GRID ARRAY
Peak Reflow Temperature (Cel)	245
Qualification Status	Not Qualified	Not Qualified
Seated Height-Max	2.52 mm	2.05 mm
Speed	50 MHz
Supply Voltage-Max	3.465 V	3.465 V
Supply Voltage-Min	3.135 V	3.135 V
Supply Voltage-Nom	3.3 V	3.3 V
Surface Mount	YES	YES
Technology	CMOS	CMOS
Terminal Finish	Tin/Lead (Sn/Pb)
Terminal Form	BALL	BALL
Terminal Pitch	1.27 mm	1.27 mm
Terminal Position	BOTTOM	BOTTOM
Time@Peak Reflow Temperature-Max (s)	30
Width	25 mm	25 mm
uPs/uCs/Peripheral ICs Type	MICROPROCESSOR, RISC	SoC
Base Number Matches	3	3
	Microcontrollers and Processors » Microprocessors	Microcontrollers and Processors » Microprocessors