MPC860ENVR50D4R2
vs
MPC860SRZQ50D4R2
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Transferred
|
Obsolete
|
Ihs Manufacturer |
FREESCALE SEMICONDUCTOR INC
|
NXP SEMICONDUCTORS
|
Part Package Code |
BGA
|
|
Package Description |
25 X 25 MM, 1.27 MM PITCH, LEAD FREE, PLASTIC, BGA-357
|
,
|
Pin Count |
357
|
|
Reach Compliance Code |
compliant
|
unknown
|
ECCN Code |
3A991.A.2
|
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Samacsys Manufacturer |
NXP
|
|
Address Bus Width |
32
|
|
Bit Size |
32
|
|
Boundary Scan |
YES
|
|
Clock Frequency-Max |
50 MHz
|
|
External Data Bus Width |
32
|
|
Format |
FIXED POINT
|
|
Integrated Cache |
YES
|
|
JESD-30 Code |
S-PBGA-B357
|
|
JESD-609 Code |
e1
|
|
Length |
25 mm
|
|
Low Power Mode |
YES
|
|
Moisture Sensitivity Level |
3
|
|
Number of Terminals |
357
|
|
Package Body Material |
PLASTIC/EPOXY
|
|
Package Code |
BGA
|
|
Package Shape |
SQUARE
|
|
Package Style |
GRID ARRAY
|
|
Peak Reflow Temperature (Cel) |
245
|
|
Seated Height-Max |
2.52 mm
|
|
Speed |
50 MHz
|
|
Supply Voltage-Max |
3.465 V
|
|
Supply Voltage-Min |
3.135 V
|
|
Supply Voltage-Nom |
3.3 V
|
|
Surface Mount |
YES
|
|
Technology |
CMOS
|
|
Terminal Finish |
Tin/Silver/Copper (Sn/Ag/Cu)
|
|
Terminal Form |
BALL
|
|
Terminal Pitch |
1.27 mm
|
|
Terminal Position |
BOTTOM
|
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Width |
25 mm
|
|
uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
MICROPROCESSOR, RISC
|
Base Number Matches |
1
|
1
|
|
|
|
Compare MPC860ENVR50D4R2 with alternatives
Compare MPC860SRZQ50D4R2 with alternatives