MPC860DTZQ50D4
vs
MPC860ENZQ50D4R2
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
NXP SEMICONDUCTORS
ROCHESTER ELECTRONICS LLC
Package Description
,
25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357
Reach Compliance Code
unknown
unknown
HTS Code
8542.31.00.01
Category CO2 Kg
12.2
12.2
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
MICROPROCESSOR, RISC
Base Number Matches
2
3
Pbfree Code
Rohs Code
Part Package Code
BGA
Pin Count
357
Address Bus Width
32
Bit Size
32
Boundary Scan
YES
Clock Frequency-Max
50 MHz
External Data Bus Width
32
Format
FIXED POINT
Integrated Cache
YES
JESD-30 Code
S-PBGA-B357
JESD-609 Code
e0
Length
25 mm
Low Power Mode
YES
Moisture Sensitivity Level
3
Number of Terminals
357
Package Body Material
PLASTIC/EPOXY
Package Code
BGA
Package Shape
SQUARE
Package Style
GRID ARRAY
Peak Reflow Temperature (Cel)
245
Qualification Status
COMMERCIAL
Seated Height-Max
2.52 mm
Speed
50 MHz
Supply Voltage-Max
3.465 V
Supply Voltage-Min
3.135 V
Supply Voltage-Nom
3.3 V
Surface Mount
YES
Terminal Finish
TIN LEAD
Terminal Form
BALL
Terminal Pitch
1.27 mm
Terminal Position
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
Width
25 mm
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