MPC860DPVR50D4R2
vs
XPC860SRCZP50D3
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
FREESCALE SEMICONDUCTOR INC
Package Description
,
BGA,
Reach Compliance Code
compliant
unknown
HTS Code
8542.31.00.01
8542.31.00.01
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
MICROPROCESSOR, RISC
Base Number Matches
1
1
Part Package Code
BGA
Pin Count
357
ECCN Code
5A991
Address Bus Width
32
Bit Size
32
Boundary Scan
YES
Clock Frequency-Max
50 MHz
External Data Bus Width
32
Format
FIXED POINT
Integrated Cache
YES
JESD-30 Code
S-PBGA-B357
Length
25 mm
Low Power Mode
YES
Number of Terminals
357
Package Body Material
PLASTIC/EPOXY
Package Code
BGA
Package Shape
SQUARE
Package Style
GRID ARRAY
Qualification Status
Not Qualified
Seated Height-Max
2.05 mm
Speed
50 MHz
Supply Voltage-Max
3.465 V
Supply Voltage-Min
3.135 V
Supply Voltage-Nom
3.3 V
Surface Mount
YES
Technology
CMOS
Terminal Form
BALL
Terminal Pitch
1.27 mm
Terminal Position
BOTTOM
Width
25 mm
Compare MPC860DPVR50D4R2 with alternatives
Compare XPC860SRCZP50D3 with alternatives