MPC8572ECVTAULD
vs
MPC8572CVTAULB
feature comparison
Pbfree Code |
No
|
|
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
FREESCALE SEMICONDUCTOR INC
|
FREESCALE SEMICONDUCTOR INC
|
Part Package Code |
BGA
|
BGA
|
Package Description |
33 X 33 MM, LEAD FREE, PLASTIC, FCBGA-1023
|
HBGA,
|
Pin Count |
1023
|
1023
|
Reach Compliance Code |
not_compliant
|
unknown
|
ECCN Code |
5A002
|
3A991.A.2
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Address Bus Width |
32
|
32
|
Bit Size |
32
|
32
|
Boundary Scan |
YES
|
YES
|
Clock Frequency-Max |
133 MHz
|
133 MHz
|
External Data Bus Width |
32
|
32
|
Format |
FLOATING POINT
|
FLOATING POINT
|
Integrated Cache |
YES
|
YES
|
JESD-30 Code |
S-PBGA-B1023
|
S-PBGA-B1023
|
JESD-609 Code |
e2
|
e2
|
Length |
33 mm
|
33 mm
|
Low Power Mode |
YES
|
YES
|
Moisture Sensitivity Level |
3
|
|
Number of Terminals |
1023
|
1023
|
Operating Temperature-Max |
105 °C
|
|
Operating Temperature-Min |
-40 °C
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
HBGA
|
HBGA
|
Package Equivalence Code |
BGA1023,32X32,40
|
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY, HEAT SINK/SLUG
|
GRID ARRAY, HEAT SINK/SLUG
|
Peak Reflow Temperature (Cel) |
245
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
3.38 mm
|
3.38 mm
|
Speed |
1333 MHz
|
1333 MHz
|
Supply Voltage-Max |
1.155 V
|
1.155 V
|
Supply Voltage-Min |
1.045 V
|
1.045 V
|
Supply Voltage-Nom |
1.1 V
|
1.1 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
|
Terminal Finish |
Tin/Silver (Sn/Ag)
|
TIN SILVER
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1 mm
|
1 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Width |
33 mm
|
33 mm
|
uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR
|
MICROPROCESSOR
|
Base Number Matches |
1
|
1
|
|
|
|
Compare MPC8572ECVTAULD with alternatives
Compare MPC8572CVTAULB with alternatives