MPC8560CVT667LC
vs
MPC8540VTAQFC
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
FREESCALE SEMICONDUCTOR INC
NXP SEMICONDUCTORS
Part Package Code
BGA
Package Description
BGA,
29 X 29 MM, 3.75 MM HEIGHT, 1 MM PITCH, LEAD FREE, FLIP CHIP, PLASTIC, BGA-783
Pin Count
783
Reach Compliance Code
unknown
not_compliant
ECCN Code
3A991.A.2
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
64
64
Bit Size
32
32
Boundary Scan
YES
YES
Clock Frequency-Max
166 MHz
166 MHz
External Data Bus Width
64
64
Format
FIXED POINT
FIXED POINT
Integrated Cache
YES
YES
JESD-30 Code
S-PBGA-B783
S-PBGA-B783
Length
29 mm
29 mm
Low Power Mode
YES
YES
Number of Terminals
783
783
Operating Temperature-Max
105 °C
105 °C
Operating Temperature-Min
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
3.85 mm
3.85 mm
Speed
667 MHz
667 MHz
Supply Voltage-Max
1.26 V
1.26 V
Supply Voltage-Min
1.14 V
1.14 V
Supply Voltage-Nom
1.2 V
1.2 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
OTHER
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Width
29 mm
29 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
MICROPROCESSOR
Base Number Matches
2
2
Rohs Code
Factory Lead Time
4 Weeks
JESD-609 Code
e2
Moisture Sensitivity Level
3
Peak Reflow Temperature (Cel)
260
Terminal Finish
Tin/Silver (Sn/Ag)
Time@Peak Reflow Temperature-Max (s)
40
Compare MPC8560CVT667LC with alternatives
Compare MPC8540VTAQFC with alternatives