MPC8560CVT667LC
vs
MPC8540CVT667JC
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
NXP SEMICONDUCTORS
Package Description
BGA,
29 X 29 MM, 3.75 MM HEIGHT, 1 MM PITCH, LEAD FREE, FLIP CHIP, PLASTIC, BGA-783
Reach Compliance Code
unknown
not_compliant
ECCN Code
3A991.A.2
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Base Number Matches
2
2
Rohs Code
Address Bus Width
64
Bit Size
32
Boundary Scan
YES
Clock Frequency-Max
166 MHz
External Data Bus Width
64
Format
FIXED POINT
Integrated Cache
YES
JESD-30 Code
S-PBGA-B783
JESD-609 Code
e2
Length
29 mm
Low Power Mode
YES
Moisture Sensitivity Level
3
Number of Terminals
783
Operating Temperature-Max
105 °C
Operating Temperature-Min
-40 °C
Package Body Material
PLASTIC/EPOXY
Package Code
BGA
Package Shape
SQUARE
Package Style
GRID ARRAY
Peak Reflow Temperature (Cel)
260
Qualification Status
Not Qualified
Seated Height-Max
3.85 mm
Speed
667 MHz
Supply Voltage-Max
1.26 V
Supply Voltage-Min
1.14 V
Supply Voltage-Nom
1.2 V
Surface Mount
YES
Technology
CMOS
Temperature Grade
INDUSTRIAL
Terminal Finish
Tin/Silver (Sn/Ag)
Terminal Form
BALL
Terminal Pitch
1 mm
Terminal Position
BOTTOM
Time@Peak Reflow Temperature-Max (s)
40
Width
29 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR
Compare MPC8560CVT667LC with alternatives
Compare MPC8540CVT667JC with alternatives