MPC8543VTAQGB
vs
MPC8547CVUAQJA
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
FREESCALE SEMICONDUCTOR INC
FREESCALE SEMICONDUCTOR INC
Part Package Code
BGA
BGA
Package Description
29 X 29 MM, 1 MM PITCH, ROHS COMPLIANT, PLASTIC, FCBGA-783
BGA,
Pin Count
783
783
Reach Compliance Code
not_compliant
compliant
ECCN Code
5A992
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
64
64
Bit Size
32
32
Boundary Scan
YES
YES
Clock Frequency-Max
133 MHz
133 MHz
External Data Bus Width
64
64
Format
FLOATING POINT
FLOATING POINT
Integrated Cache
YES
YES
JESD-30 Code
S-PBGA-B783
S-CBGA-B783
Length
29 mm
29 mm
Low Power Mode
YES
YES
Moisture Sensitivity Level
3
Number of Terminals
783
783
Operating Temperature-Max
105 °C
105 °C
Operating Temperature-Min
-40 °C
Package Body Material
PLASTIC/EPOXY
CERAMIC, METAL-SEALED COFIRED
Package Code
BGA
BGA
Package Equivalence Code
BGA783,28X28,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Peak Reflow Temperature (Cel)
260
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
3.38 mm
3.38 mm
Speed
1000 MHz
1000 MHz
Supply Voltage-Max
1.155 V
1.155 V
Supply Voltage-Min
1.045 V
1.045 V
Supply Voltage-Nom
1.1 V
1.1 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
OTHER
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
40
Width
29 mm
29 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
MICROPROCESSOR
Base Number Matches
1
1
Category CO2 Kg
12.2
Compliance Temperature Grade
Industrial: -40C to +105C
EU RoHS Version
RoHS 2 (2011/65/EU)
Candidate List Date
2011-12-19
JESD-609 Code
e1
Terminal Finish
TIN SILVER COPPER
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