MPC8543VTAQGB
vs
MPC8545CVTAQGA
feature comparison
All Stats
Differences Only
Pbfree Code
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
ROCHESTER ELECTRONICS INC
FREESCALE SEMICONDUCTOR INC
Part Package Code
BGA
BGA
Package Description
BGA,
BGA, BGA783,28X28,40
Pin Count
783
783
Reach Compliance Code
unknown
compliant
Address Bus Width
64
64
Bit Size
32
32
Boundary Scan
YES
YES
Clock Frequency-Max
133 MHz
133 MHz
External Data Bus Width
64
64
Format
FLOATING POINT
FLOATING POINT
Integrated Cache
YES
YES
JESD-30 Code
S-PBGA-B783
S-PBGA-B783
JESD-609 Code
e2
e2
Length
29 mm
29 mm
Low Power Mode
YES
YES
Moisture Sensitivity Level
3
Number of Terminals
783
783
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Peak Reflow Temperature (Cel)
260
NOT SPECIFIED
Qualification Status
COMMERCIAL
Not Qualified
Seated Height-Max
3.38 mm
3.38 mm
Speed
1000 MHz
1000 MHz
Supply Voltage-Max
1.155 V
1.155 V
Supply Voltage-Min
1.045 V
1.045 V
Supply Voltage-Nom
1.1 V
1.1 V
Surface Mount
YES
YES
Terminal Finish
TIN COPPER/TIN SILVER
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
40
NOT SPECIFIED
Width
29 mm
29 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR
MICROPROCESSOR, RISC
Base Number Matches
2
1
Rohs Code
ECCN Code
3A991.A.2
HTS Code
8542.31.00.01
Operating Temperature-Max
105 °C
Operating Temperature-Min
-40 °C
Package Equivalence Code
BGA783,28X28,40
Technology
CMOS
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