MPC8541PXAPF vs MPC8541VTAPF feature comparison

MPC8541PXAPF Freescale Semiconductor

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MPC8541VTAPF Rochester Electronics LLC

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Pbfree Code No No
Rohs Code No Yes
Part Life Cycle Code Transferred Active
Ihs Manufacturer FREESCALE SEMICONDUCTOR INC ROCHESTER ELECTRONICS LLC
Part Package Code BGA BGA
Package Description 29 X 29 MM, 3.75 MM HEIGHT, 1 MM PITCH, FLIP CHIP, PLASTIC, BGA-783 29 X 29 MM, 3.75 MM HEIGHT, 1 MM PITCH, LEAD FREE, FLIP CHIP, PLASTIC, BGA-783
Pin Count 783 783
Reach Compliance Code not_compliant unknown
ECCN Code 5A992
HTS Code 8542.31.00.01
Address Bus Width 64 64
Bit Size 32 32
Boundary Scan YES YES
Clock Frequency-Max 166 MHz 166 MHz
External Data Bus Width 64 64
Format FLOATING POINT FLOATING POINT
Integrated Cache YES YES
JESD-30 Code R-PBGA-B783 R-PBGA-B783
JESD-609 Code e0 e2
Length 29 mm 29 mm
Low Power Mode YES YES
Moisture Sensitivity Level 3 3
Number of Terminals 783 783
Operating Temperature-Max 105 °C 105 °C
Operating Temperature-Min
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code HBGA HBGA
Package Equivalence Code BGA783,28X28,40
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, HEAT SINK/SLUG GRID ARRAY, HEAT SINK/SLUG
Peak Reflow Temperature (Cel) 245 260
Qualification Status Not Qualified COMMERCIAL
Seated Height-Max 3.75 mm 3.75 mm
Speed 833 MHz 833 MHz
Supply Voltage-Max 1.26 V 1.26 V
Supply Voltage-Min 1.14 V 1.14 V
Supply Voltage-Nom 1.2 V 1.2 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER OTHER
Terminal Finish Tin/Lead/Silver (Sn/Pb/Ag) TIN COPPER/TIN SILVER
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 40
Width 29 mm 29 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 2 3

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