MPC8541EVTALD
vs
MPC8541EPXALEX
feature comparison
All Stats
Differences Only
Pbfree Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
FREESCALE SEMICONDUCTOR INC
NXP SEMICONDUCTORS
Part Package Code
BGA
Package Description
HBGA,
BGA,
Pin Count
783
Reach Compliance Code
unknown
unknown
ECCN Code
3A991.A.2
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
64
Bit Size
32
Boundary Scan
YES
Clock Frequency-Max
166 MHz
External Data Bus Width
64
Format
FLOATING POINT
Integrated Cache
YES
JESD-30 Code
S-PBGA-B783
Length
29 mm
Low Power Mode
YES
Number of Terminals
783
Operating Temperature-Max
105 °C
Operating Temperature-Min
Package Body Material
PLASTIC/EPOXY
Package Code
HBGA
Package Shape
SQUARE
Package Style
GRID ARRAY, HEAT SINK/SLUG
Qualification Status
Not Qualified
Seated Height-Max
3.75 mm
Speed
667 MHz
Supply Voltage-Max
1.26 V
Supply Voltage-Min
1.14 V
Supply Voltage-Nom
1.2 V
Surface Mount
YES
Technology
CMOS
Temperature Grade
OTHER
Terminal Form
BALL
Terminal Pitch
1 mm
Terminal Position
BOTTOM
Width
29 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
Base Number Matches
2
2
Compare MPC8541EVTALD with alternatives
Compare MPC8541EPXALEX with alternatives