MPC8541ECVTAPF
vs
MPC8541EPXAQF
feature comparison
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
NXP SEMICONDUCTORS
|
NXP SEMICONDUCTORS
|
Package Description |
HBGA,
|
29 X 29 MM, 3.75 MM HEIGHT, 1 MM PITCH, FLIP CHIP, PLASTIC, BGA-783
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
3A991.A.2
|
5A002.A.1
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Address Bus Width |
64
|
64
|
Bit Size |
32
|
32
|
Boundary Scan |
YES
|
YES
|
Clock Frequency-Max |
166 MHz
|
166 MHz
|
External Data Bus Width |
64
|
64
|
Format |
FLOATING POINT
|
FLOATING POINT
|
Integrated Cache |
YES
|
YES
|
JESD-30 Code |
S-PBGA-B783
|
S-PBGA-B783
|
Length |
29 mm
|
29 mm
|
Low Power Mode |
YES
|
YES
|
Number of Terminals |
783
|
783
|
Operating Temperature-Max |
105 °C
|
105 °C
|
Operating Temperature-Min |
-40 °C
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
HBGA
|
HBGA
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY, HEAT SINK/SLUG
|
GRID ARRAY, HEAT SINK/SLUG
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
3.75 mm
|
3.75 mm
|
Speed |
833 MHz
|
1000 MHz
|
Supply Voltage-Max |
1.26 V
|
1.35 V
|
Supply Voltage-Min |
1.14 V
|
1.25 V
|
Supply Voltage-Nom |
1.2 V
|
1.3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
OTHER
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1 mm
|
1 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Width |
29 mm
|
29 mm
|
uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
MICROPROCESSOR, RISC
|
Base Number Matches |
2
|
2
|
Rohs Code |
|
No
|
Factory Lead Time |
|
4 Weeks
|
JESD-609 Code |
|
e0
|
Moisture Sensitivity Level |
|
3
|
Peak Reflow Temperature (Cel) |
|
245
|
Terminal Finish |
|
Tin/Lead (Sn/Pb)
|
Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare MPC8541ECVTAPF with alternatives
Compare MPC8541EPXAQF with alternatives