MPC8541EPXAQF
vs
MPC8541EVTAPF
feature comparison
Pbfree Code |
No
|
No
|
Rohs Code |
No
|
Yes
|
Part Life Cycle Code |
Transferred
|
Active
|
Ihs Manufacturer |
FREESCALE SEMICONDUCTOR INC
|
ROCHESTER ELECTRONICS LLC
|
Part Package Code |
BGA
|
BGA
|
Package Description |
HBGA, BGA783,28X28,40
|
29 X 29 MM, 3.75 MM HEIGHT, 1 MM PITCH, LEAD FREE, FLIP CHIP, PLASTIC, BGA-783
|
Pin Count |
783
|
783
|
Reach Compliance Code |
not_compliant
|
unknown
|
ECCN Code |
5A002
|
|
HTS Code |
8542.31.00.01
|
|
Address Bus Width |
64
|
64
|
Bit Size |
32
|
32
|
Boundary Scan |
YES
|
YES
|
Clock Frequency-Max |
166 MHz
|
166 MHz
|
External Data Bus Width |
64
|
64
|
Format |
FLOATING POINT
|
FLOATING POINT
|
Integrated Cache |
YES
|
YES
|
JESD-30 Code |
S-PBGA-B783
|
R-PBGA-B783
|
JESD-609 Code |
e0
|
e2
|
Length |
29 mm
|
29 mm
|
Low Power Mode |
YES
|
YES
|
Moisture Sensitivity Level |
3
|
3
|
Number of Terminals |
783
|
783
|
Operating Temperature-Max |
105 °C
|
105 °C
|
Operating Temperature-Min |
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
HBGA
|
HBGA
|
Package Equivalence Code |
BGA783,28X28,40
|
|
Package Shape |
SQUARE
|
RECTANGULAR
|
Package Style |
GRID ARRAY, HEAT SINK/SLUG
|
GRID ARRAY, HEAT SINK/SLUG
|
Peak Reflow Temperature (Cel) |
245
|
260
|
Qualification Status |
Not Qualified
|
COMMERCIAL
|
Seated Height-Max |
3.75 mm
|
3.75 mm
|
Speed |
1000 MHz
|
833 MHz
|
Supply Voltage-Max |
1.35 V
|
1.26 V
|
Supply Voltage-Min |
1.25 V
|
1.14 V
|
Supply Voltage-Nom |
1.3 V
|
1.2 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
OTHER
|
OTHER
|
Terminal Finish |
Tin/Lead/Silver (Sn/Pb/Ag)
|
TIN COPPER/TIN SILVER
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1 mm
|
1 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
30
|
40
|
Width |
29 mm
|
29 mm
|
uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
MICROPROCESSOR, RISC
|
Base Number Matches |
2
|
3
|
|
|
|
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