Findchips: Compare MPC8541CVTAPF vs MPC8541ECVTAPD

MPC8541CVTAPF vs MPC8541ECVTAPD feature comparison

Buy Now Datasheet

Buy Now Datasheet

Part Life Cycle Code	Obsolete	Obsolete
Ihs Manufacturer	NXP SEMICONDUCTORS	NXP SEMICONDUCTORS
Package Description	HBGA,	HBGA,
Reach Compliance Code	unknown	unknown
ECCN Code	3A991.A.2	3A991.A.2
HTS Code	8542.31.00.01	8542.31.00.01
Address Bus Width	64	64
Bit Size	32	32
Boundary Scan	YES	YES
Clock Frequency-Max	166 MHz	166 MHz
External Data Bus Width	64	64
Format	FLOATING POINT	FLOATING POINT
Integrated Cache	YES	YES
JESD-30 Code	S-PBGA-B783	S-PBGA-B783
Length	29 mm	29 mm
Low Power Mode	YES	YES
Number of Terminals	783	783
Operating Temperature-Max	105 °C	105 °C
Operating Temperature-Min	-40 °C	-40 °C
Package Body Material	PLASTIC/EPOXY	PLASTIC/EPOXY
Package Code	HBGA	HBGA
Package Shape	SQUARE	SQUARE
Package Style	GRID ARRAY, HEAT SINK/SLUG	GRID ARRAY, HEAT SINK/SLUG
Qualification Status	Not Qualified	Not Qualified
Seated Height-Max	3.75 mm	3.75 mm
Speed	833 MHz	833 MHz
Supply Voltage-Max	1.26 V	1.26 V
Supply Voltage-Min	1.14 V	1.14 V
Supply Voltage-Nom	1.2 V	1.2 V
Surface Mount	YES	YES
Technology	CMOS	CMOS
Temperature Grade	INDUSTRIAL	INDUSTRIAL
Terminal Form	BALL	BALL
Terminal Pitch	1 mm	1 mm
Terminal Position	BOTTOM	BOTTOM
Width	29 mm	29 mm
uPs/uCs/Peripheral ICs Type	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC
Base Number Matches	2	2
	Microcontrollers and Processors » Microprocessors	Microcontrollers and Processors » Microprocessors