MPC8540CVTAQFC
vs
MPC8541EPXAPF
feature comparison
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
FREESCALE SEMICONDUCTOR INC
|
| Package Description |
BGA,
|
29 X 29 MM, 3.75 MM HEIGHT, 1 MM PITCH, FLIP CHIP, PLASTIC, BGA-783
|
| Reach Compliance Code |
unknown
|
not_compliant
|
| ECCN Code |
3A991.A.2
|
5A002
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Base Number Matches |
1
|
3
|
| Pbfree Code |
|
No
|
| Rohs Code |
|
No
|
| Part Package Code |
|
BGA
|
| Pin Count |
|
783
|
| Samacsys Manufacturer |
|
NXP
|
| Address Bus Width |
|
64
|
| Bit Size |
|
32
|
| Boundary Scan |
|
YES
|
| Clock Frequency-Max |
|
166 MHz
|
| External Data Bus Width |
|
64
|
| Format |
|
FLOATING POINT
|
| Integrated Cache |
|
YES
|
| JESD-30 Code |
|
R-PBGA-B783
|
| JESD-609 Code |
|
e0
|
| Length |
|
29 mm
|
| Low Power Mode |
|
YES
|
| Moisture Sensitivity Level |
|
3
|
| Number of Terminals |
|
783
|
| Operating Temperature-Max |
|
105 °C
|
| Operating Temperature-Min |
|
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Code |
|
HBGA
|
| Package Equivalence Code |
|
BGA783,28X28,40
|
| Package Shape |
|
RECTANGULAR
|
| Package Style |
|
GRID ARRAY, HEAT SINK/SLUG
|
| Peak Reflow Temperature (Cel) |
|
245
|
| Qualification Status |
|
Not Qualified
|
| Seated Height-Max |
|
3.75 mm
|
| Speed |
|
833 MHz
|
| Supply Voltage-Max |
|
1.26 V
|
| Supply Voltage-Min |
|
1.14 V
|
| Supply Voltage-Nom |
|
1.2 V
|
| Surface Mount |
|
YES
|
| Technology |
|
CMOS
|
| Temperature Grade |
|
OTHER
|
| Terminal Finish |
|
Tin/Lead/Silver (Sn/Pb/Ag)
|
| Terminal Form |
|
BALL
|
| Terminal Pitch |
|
1 mm
|
| Terminal Position |
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
| Width |
|
29 mm
|
| uPs/uCs/Peripheral ICs Type |
|
MICROPROCESSOR, RISC
|
|
|
|
Compare MPC8540CVTAQFC with alternatives
Compare MPC8541EPXAPF with alternatives