MPC850SEZT50
vs
79RC32H434-300BC
feature comparison
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
MOTOROLA INC
|
INTEGRATED DEVICE TECHNOLOGY INC
|
Package Description |
BGA,
|
17 X 17 MM, MO-192AAF1, CABGA-256
|
Reach Compliance Code |
unknown
|
not_compliant
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
JESD-30 Code |
R-PBGA-B256
|
S-PBGA-B256
|
Number of Terminals |
256
|
256
|
Operating Temperature-Max |
70 °C
|
70 °C
|
Operating Temperature-Min |
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
BGA
|
LBGA
|
Package Shape |
RECTANGULAR
|
SQUARE
|
Package Style |
GRID ARRAY
|
GRID ARRAY, LOW PROFILE
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Supply Voltage-Nom |
3.3 V
|
1.2 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
Terminal Form |
BALL
|
BALL
|
Terminal Position |
BOTTOM
|
BOTTOM
|
uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
MICROPROCESSOR, RISC
|
Base Number Matches |
2
|
1
|
Pbfree Code |
|
No
|
Rohs Code |
|
No
|
Part Package Code |
|
CABGA
|
Pin Count |
|
256
|
Manufacturer Package Code |
|
BC256
|
ECCN Code |
|
3A991.A.2
|
Additional Feature |
|
ALSO REQUIRES 3.3V SUPPLY
|
Address Bus Width |
|
32
|
Bit Size |
|
32
|
Boundary Scan |
|
YES
|
Clock Frequency-Max |
|
125 MHz
|
External Data Bus Width |
|
32
|
Format |
|
FIXED POINT
|
Integrated Cache |
|
YES
|
JESD-609 Code |
|
e0
|
Length |
|
17 mm
|
Low Power Mode |
|
NO
|
Moisture Sensitivity Level |
|
3
|
Package Equivalence Code |
|
BGA256,16X16,40
|
Peak Reflow Temperature (Cel) |
|
225
|
Seated Height-Max |
|
1.7 mm
|
Speed |
|
300 MHz
|
Supply Voltage-Max |
|
1.3 V
|
Supply Voltage-Min |
|
1.1 V
|
Terminal Finish |
|
TIN LEAD
|
Terminal Pitch |
|
1 mm
|
Time@Peak Reflow Temperature-Max (s) |
|
20
|
Width |
|
17 mm
|
|
|
|
Compare MPC850SEZT50 with alternatives
Compare 79RC32H434-300BC with alternatives