79RC32H434-300BC vs MPC604ARS25 feature comparison

79RC32H434-300BC Integrated Device Technology Inc

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MPC604ARS25 Motorola Mobility LLC

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Pbfree Code No
Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC MOTOROLA INC
Part Package Code CABGA BGA
Package Description 17 X 17 MM, MO-192AAF1, CABGA-256 BGA,
Pin Count 256 256
Manufacturer Package Code BC256
Reach Compliance Code not_compliant unknown
ECCN Code 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Additional Feature ALSO REQUIRES 3.3V SUPPLY TWO 128 ENTRY TLB; TEMP SPECIFIED AS JUNCTION TEMP
Address Bus Width 32 32
Bit Size 32 32
Boundary Scan YES YES
Clock Frequency-Max 125 MHz 25 MHz
External Data Bus Width 32 64
Format FIXED POINT FLOATING POINT
Integrated Cache YES NO
JESD-30 Code S-PBGA-B256 S-CBGA-B256
JESD-609 Code e0
Length 17 mm 21 mm
Low Power Mode NO YES
Moisture Sensitivity Level 3
Number of Terminals 256 256
Operating Temperature-Max 70 °C 105 °C
Operating Temperature-Min
Package Body Material PLASTIC/EPOXY CERAMIC, METAL-SEALED COFIRED
Package Code LBGA BGA
Package Equivalence Code BGA256,16X16,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY
Peak Reflow Temperature (Cel) 225
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.7 mm 3.16 mm
Speed 300 MHz 25 MHz
Supply Voltage-Max 1.3 V 3.465 V
Supply Voltage-Min 1.1 V 3.135 V
Supply Voltage-Nom 1.2 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL OTHER
Terminal Finish TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 20
Width 17 mm 21 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 1 2
Number of DMA Channels
Number of External Interrupts 3
Number of Serial I/Os
On Chip Data RAM Width
RAM (words) 0

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