MPC850DCZT50A
vs
XPC850DECVR50BU
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MOTOROLA INC
FREESCALE SEMICONDUCTOR INC
Package Description
PLASTIC, BGA-256
23 X 23 MM, 1.22 MM HEIGHT, 1.27 MM PITCH, PLASTIC, BGA-256
Reach Compliance Code
unknown
compliant
HTS Code
8542.31.00.01
8542.31.00.01
JESD-30 Code
R-PBGA-B256
S-PBGA-B256
Number of Terminals
256
256
Operating Temperature-Max
70 °C
Operating Temperature-Min
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Shape
RECTANGULAR
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Nom
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
Terminal Form
BALL
BALL
Terminal Position
BOTTOM
BOTTOM
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
MICROPROCESSOR, RISC
Base Number Matches
2
1
Rohs Code
Part Package Code
BGA
Pin Count
256
ECCN Code
5A991
Address Bus Width
26
Bit Size
32
Boundary Scan
YES
Clock Frequency-Max
50 MHz
External Data Bus Width
32
Format
FIXED POINT
Integrated Cache
YES
JESD-609 Code
e1
Length
23 mm
Low Power Mode
YES
Moisture Sensitivity Level
3
Peak Reflow Temperature (Cel)
260
Seated Height-Max
2.35 mm
Speed
50 MHz
Supply Voltage-Max
3.465 V
Supply Voltage-Min
3.135 V
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Pitch
1.27 mm
Time@Peak Reflow Temperature-Max (s)
40
Width
23 mm
Compare MPC850DCZT50A with alternatives
Compare XPC850DECVR50BU with alternatives