XPC850DECVR50BU vs XPC850ZT50B feature comparison

XPC850DECVR50BU Freescale Semiconductor

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XPC850ZT50B Freescale Semiconductor

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Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer FREESCALE SEMICONDUCTOR INC MOTOROLA SEMICONDUCTOR PRODUCTS
Part Package Code BGA
Package Description 23 X 23 MM, 1.22 MM HEIGHT, 1.27 MM PITCH, PLASTIC, BGA-256 BGA, BGA256,16X16,50
Pin Count 256
Reach Compliance Code compliant unknown
ECCN Code 5A991
HTS Code 8542.31.00.01
Address Bus Width 26
Bit Size 32 32
Boundary Scan YES
Clock Frequency-Max 50 MHz
External Data Bus Width 32
Format FIXED POINT
Integrated Cache YES
JESD-30 Code S-PBGA-B256 S-PBGA-B256
JESD-609 Code e1 e0
Length 23 mm
Low Power Mode YES
Moisture Sensitivity Level 3
Number of Terminals 256 256
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.35 mm
Speed 50 MHz 50 MHz
Supply Voltage-Max 3.465 V
Supply Voltage-Min 3.135 V
Supply Voltage-Nom 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu) Tin/Lead (Sn/Pb)
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 40
Width 23 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 1 3
Package Equivalence Code BGA256,16X16,50
Power Supplies 3.3 V

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