MPC8347ECZUAJFB
vs
MPC8347EVVAGDA
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
FREESCALE SEMICONDUCTOR INC
NXP SEMICONDUCTORS
Part Package Code
BGA
Package Description
35 X 35 MM, 1.46 MM HEIGHT, 1 MM PITCH, TBGA-672
LBGA, BGA672,34X34,40
Pin Count
672
Reach Compliance Code
not_compliant
compliant
ECCN Code
5A002
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Additional Feature
ALSO REQUIRES 2.5V AND 3.3V SUPPLY
ALSO REQUIRES 2.5V AND 3.3V SUPPLY
Address Bus Width
32
32
Bit Size
32
32
Boundary Scan
YES
YES
Clock Frequency-Max
66 MHz
66 MHz
External Data Bus Width
32
32
Format
FLOATING POINT
FLOATING POINT
Integrated Cache
YES
YES
JESD-30 Code
S-PBGA-B672
S-PBGA-B672
JESD-609 Code
e0
Length
35 mm
35 mm
Low Power Mode
YES
YES
Moisture Sensitivity Level
3
Number of Terminals
672
672
Operating Temperature-Max
105 °C
105 °C
Operating Temperature-Min
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LBGA
LBGA
Package Equivalence Code
BGA672,34X34,40
BGA672,34X34,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, LOW PROFILE
GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel)
260
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.69 mm
1.69 mm
Speed
533 MHz
400 MHz
Supply Voltage-Max
1.26 V
1.26 V
Supply Voltage-Min
1.14 V
1.14 V
Supply Voltage-Nom
1.2 V
1.2 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
OTHER
Terminal Finish
Tin/Lead/Silver (Sn/Pb/Ag)
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
40
Width
35 mm
35 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR
MICROPROCESSOR
Base Number Matches
1
2
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