MPC8347ECZUAJFB
vs
PC8349EVTPYAGFB
feature comparison
Rohs Code |
No
|
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
FREESCALE SEMICONDUCTOR INC
|
TELEDYNE E2V (UK) LTD
|
Part Package Code |
BGA
|
BGA
|
Package Description |
35 X 35 MM, 1.46 MM HEIGHT, 1 MM PITCH, TBGA-672
|
LBGA,
|
Pin Count |
672
|
672
|
Reach Compliance Code |
not_compliant
|
compliant
|
ECCN Code |
5A002
|
3A991.A.2
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Additional Feature |
ALSO REQUIRES 2.5V AND 3.3V SUPPLY
|
ALSO OPERATES AT 1.14 V MINIMUM SUPPLY AT 533 MHZ
|
Address Bus Width |
32
|
|
Bit Size |
32
|
32
|
Boundary Scan |
YES
|
YES
|
Clock Frequency-Max |
66 MHz
|
66 MHz
|
External Data Bus Width |
32
|
|
Format |
FLOATING POINT
|
FLOATING POINT
|
Integrated Cache |
YES
|
YES
|
JESD-30 Code |
S-PBGA-B672
|
S-PBGA-B672
|
JESD-609 Code |
e0
|
|
Length |
35 mm
|
35 mm
|
Low Power Mode |
YES
|
YES
|
Moisture Sensitivity Level |
3
|
|
Number of Terminals |
672
|
672
|
Operating Temperature-Max |
105 °C
|
|
Operating Temperature-Min |
-40 °C
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
LBGA
|
LBGA
|
Package Equivalence Code |
BGA672,34X34,40
|
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY, LOW PROFILE
|
GRID ARRAY, LOW PROFILE
|
Peak Reflow Temperature (Cel) |
260
|
|
Qualification Status |
Not Qualified
|
|
Seated Height-Max |
1.69 mm
|
1.69 mm
|
Speed |
533 MHz
|
400 MHz
|
Supply Voltage-Max |
1.26 V
|
1.3625 V
|
Supply Voltage-Min |
1.14 V
|
1.24 V
|
Supply Voltage-Nom |
1.2 V
|
1.3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
|
Terminal Finish |
Tin/Lead/Silver (Sn/Pb/Ag)
|
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1 mm
|
1 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
40
|
|
Width |
35 mm
|
35 mm
|
uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR
|
MICROPROCESSOR
|
Base Number Matches |
1
|
1
|
|
|
|
Compare MPC8347ECZUAJFB with alternatives
Compare PC8349EVTPYAGFB with alternatives