MPC8323ECVRAFDC
vs
MPC8323ECZQAFDCA
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
NXP SEMICONDUCTORS
FREESCALE SEMICONDUCTOR INC
Package Description
HBGA,
BGA,
Reach Compliance Code
unknown
unknown
ECCN Code
5A002
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Factory Lead Time
4 Weeks
Address Bus Width
14
Boundary Scan
YES
YES
External Data Bus Width
32
Format
FLOATING POINT
FLOATING POINT
Integrated Cache
YES
YES
JESD-30 Code
S-PBGA-B516
S-PBGA-B516
Length
27 mm
27 mm
Low Power Mode
YES
YES
Number of Terminals
516
516
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
HBGA
BGA
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, HEAT SINK/SLUG
GRID ARRAY
Peak Reflow Temperature (Cel)
260
Seated Height-Max
2.55 mm
2.55 mm
Speed
333 MHz
333 MHz
Supply Voltage-Max
1.05 V
1.05 V
Supply Voltage-Min
0.95 V
0.95 V
Supply Voltage-Nom
1 V
1 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
40
Width
27 mm
27 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
MICROPROCESSOR, RISC
Base Number Matches
3
2
Part Package Code
BGA
Pin Count
516
Bit Size
32
Clock Frequency-Max
66.67 MHz
JESD-609 Code
e0
Qualification Status
Not Qualified
Terminal Finish
TIN LEAD SILVER
Compare MPC8323ECVRAFDC with alternatives
Compare MPC8323ECZQAFDCA with alternatives