MPC8313VRAFFC vs MPC8275CVRMIBA feature comparison

MPC8313VRAFFC Freescale Semiconductor

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MPC8275CVRMIBA NXP Semiconductors

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Pbfree Code Yes
Rohs Code Yes Yes
Part Life Cycle Code Transferred Not Recommended
Ihs Manufacturer FREESCALE SEMICONDUCTOR INC NXP SEMICONDUCTORS
Part Package Code BGA
Package Description 27 X 27 MM, 2.25 MM HEIGHT, 1 MM PITCH, LEAD FREE, TEPBGA-516 27 X 27 MM, 1 MM PITCH, LEAD FREE, PLASTIC, FBGA-516
Pin Count 516
Reach Compliance Code compliant compliant
ECCN Code 3A991.A.2 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Samacsys Manufacturer NXP NXP
Address Bus Width 32
Bit Size 32 32
Boundary Scan YES YES
Clock Frequency-Max 133 MHz 266 MHz
External Data Bus Width 64
Format FLOATING POINT FLOATING POINT
Integrated Cache YES YES
JESD-30 Code S-PBGA-B516 S-PBGA-B516
JESD-609 Code e2 e2
Length 27 mm 27 mm
Low Power Mode YES NO
Moisture Sensitivity Level 3 3
Number of Terminals 516 516
Operating Temperature-Max 105 °C
Operating Temperature-Min
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA516,26X26,40 BGA516,26X26,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 260 245
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.55 mm 2.55 mm
Speed 333 MHz 66.67 MHz
Supply Voltage-Max 1.05 V 1.6 V
Supply Voltage-Min 0.95 V 1.45 V
Supply Voltage-Nom 1 V 1.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER
Terminal Finish TIN SILVER Tin/Silver (Sn/Ag)
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 40 30
Width 27 mm 27 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 2 2
Factory Lead Time 52 Weeks

Compare MPC8313VRAFFC with alternatives

Compare MPC8275CVRMIBA with alternatives