MPC8313VRADDC
vs
MPC8250AZQIFBX
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
FREESCALE SEMICONDUCTOR INC
FREESCALE SEMICONDUCTOR INC
Part Package Code
BGA
BGA
Package Description
27 X 27 MM, 2.25 MM HEIGHT, 1 MM PITCH, LEAD FREE, PLASTIC, TEBGAII-516
BGA,
Pin Count
516
516
Reach Compliance Code
compliant
unknown
ECCN Code
3A991.A.2
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Bit Size
32
32
Boundary Scan
YES
YES
Clock Frequency-Max
66.67 MHz
66.66 MHz
Format
FLOATING POINT
FLOATING POINT
Integrated Cache
YES
YES
JESD-30 Code
S-PBGA-B516
S-PBGA-B516
JESD-609 Code
e2
Length
27 mm
27 mm
Low Power Mode
YES
NO
Moisture Sensitivity Level
3
Number of Terminals
516
516
Operating Temperature-Max
105 °C
Operating Temperature-Min
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA516,26X26,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Peak Reflow Temperature (Cel)
260
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.55 mm
2.55 mm
Speed
266 MHz
200 MHz
Supply Voltage-Max
1.05 V
1.9 V
Supply Voltage-Min
0.95 V
1.7 V
Supply Voltage-Nom
1 V
1.8 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
OTHER
Terminal Finish
TIN SILVER
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
40
Width
27 mm
27 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
MICROPROCESSOR, RISC
Base Number Matches
2
2
Additional Feature
ALSO REQUIRES 3.3V SUPPLY
Address Bus Width
32
External Data Bus Width
64
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