Part Details for MPC8313VRADDC by Freescale Semiconductor
Overview of MPC8313VRADDC by Freescale Semiconductor
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Applications
Industrial Automation
Renewable Energy
Robotics and Drones
Part Details for MPC8313VRADDC
MPC8313VRADDC CAD Models
MPC8313VRADDC Part Data Attributes
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MPC8313VRADDC
Freescale Semiconductor
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Datasheet
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MPC8313VRADDC
Freescale Semiconductor
PowerQUICC, 32 Bit Power Architecture SoC, 266MHz, DDR1/2, PCI, GbE, USB, 0 to 105C, Rev 3
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | FREESCALE SEMICONDUCTOR INC | |
| Part Package Code | BGA | |
| Package Description | 27 X 27 MM, 2.25 MM HEIGHT, 1 MM PITCH, LEAD FREE, PLASTIC, TEBGAII-516 | |
| Pin Count | 516 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.A.2 | |
| HTS Code | 8542.31.00.01 | |
| Samacsys Manufacturer | NXP | |
| Bit Size | 32 | |
| Boundary Scan | YES | |
| Clock Frequency-Max | 66.67 MHz | |
| Format | FLOATING POINT | |
| Integrated Cache | YES | |
| JESD-30 Code | S-PBGA-B516 | |
| JESD-609 Code | e2 | |
| Length | 27 mm | |
| Low Power Mode | YES | |
| Moisture Sensitivity Level | 3 | |
| Number of Terminals | 516 | |
| Operating Temperature-Max | 105 °C | |
| Operating Temperature-Min | ||
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA516,26X26,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Peak Reflow Temperature (Cel) | 260 | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 2.55 mm | |
| Speed | 266 MHz | |
| Supply Voltage-Max | 1.05 V | |
| Supply Voltage-Min | 0.95 V | |
| Supply Voltage-Nom | 1 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | OTHER | |
| Terminal Finish | TIN SILVER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 40 | |
| Width | 27 mm | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC |