MPC8313EZQAGDB
vs
MPC8313EVRAGDB
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
FREESCALE SEMICONDUCTOR INC
Package Description
27 X 27 MM, 2.25 MM HEIGHT, 1 MM PITCH, TEPBGAII-516
27 X 27 MM, 2.25 MM HEIGHT, 1 MM PITCH, LEAD FREE, TEPBGAII-516
Reach Compliance Code
unknown
compliant
ECCN Code
3A991.A.2
5A002
HTS Code
8542.31.00.01
8542.31.00.01
Additional Feature
ALSO REQUIRES 3.3V I/O SUPPLY
ALSO REQUIRES 3.3V I/O SUPPLY
Address Bus Width
32
32
Bit Size
32
32
Boundary Scan
YES
YES
Clock Frequency-Max
66.67 MHz
66.67 MHz
External Data Bus Width
32
32
Format
FLOATING POINT
FLOATING POINT
Integrated Cache
YES
YES
JESD-30 Code
S-PBGA-B516
S-PBGA-B516
JESD-609 Code
e0
e2
Length
27 mm
27 mm
Low Power Mode
YES
YES
Number of Terminals
516
516
Operating Temperature-Max
105 °C
105 °C
Operating Temperature-Min
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
HBGA
HBGA
Package Equivalence Code
BGA516,26X26,40
BGA516,26X26,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, HEAT SINK/SLUG
GRID ARRAY, HEAT SINK/SLUG
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.55 mm
2.55 mm
Speed
400 MHz
400 MHz
Supply Voltage-Max
1.5 V
1.5 V
Supply Voltage-Min
0.95 V
0.95 V
Supply Voltage-Nom
1 V
1 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
OTHER
OTHER
Terminal Finish
Tin/Lead (Sn/Pb)
TIN SILVER
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Width
27 mm
27 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR
MICROPROCESSOR
Base Number Matches
2
1
Part Package Code
BGA
Pin Count
516
Moisture Sensitivity Level
3
Peak Reflow Temperature (Cel)
260
Time@Peak Reflow Temperature-Max (s)
40
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Compare MPC8313EVRAGDB with alternatives