Findchips: Compare MPC8313EZQAGDB vs MPC8275CZQQLDX

MPC8313EZQAGDB vs MPC8275CZQQLDX feature comparison

Buy Now Datasheet

Buy Now Datasheet

Rohs Code	No
Part Life Cycle Code	Transferred	Transferred
Ihs Manufacturer	FREESCALE SEMICONDUCTOR INC	FREESCALE SEMICONDUCTOR INC
Part Package Code	BGA	BGA
Package Description	27 X 27 MM, 2.25 MM HEIGHT, 1 MM PITCH, TEPBGAII-516	BGA,
Pin Count	516	516
Reach Compliance Code	compliant	unknown
ECCN Code	3A991.A.2	3A991.A.2
HTS Code	8542.31.00.01	8542.31.00.01
Additional Feature	ALSO REQUIRES 3.3V I/O SUPPLY	ALSO REQUIRES 3.3V SUPPLY
Address Bus Width	32	32
Bit Size	32	32
Boundary Scan	YES	YES
Clock Frequency-Max	66.67 MHz	83.33 MHz
External Data Bus Width	32	64
Format	FLOATING POINT	FLOATING POINT
Integrated Cache	YES	YES
JESD-30 Code	S-PBGA-B516	S-PBGA-B516
JESD-609 Code	e0
Length	27 mm	27 mm
Low Power Mode	YES	NO
Number of Terminals	516	516
Operating Temperature-Max	105 °C	70 °C
Operating Temperature-Min
Package Body Material	PLASTIC/EPOXY	PLASTIC/EPOXY
Package Code	HBGA	BGA
Package Equivalence Code	BGA516,26X26,40
Package Shape	SQUARE	SQUARE
Package Style	GRID ARRAY, HEAT SINK/SLUG	GRID ARRAY
Qualification Status	Not Qualified	Not Qualified
Seated Height-Max	2.55 mm	2.55 mm
Speed	400 MHz	333 MHz
Supply Voltage-Max	1.5 V	1.6 V
Supply Voltage-Min	0.95 V	1.45 V
Supply Voltage-Nom	1 V	1.5 V
Surface Mount	YES	YES
Technology	CMOS	CMOS
Temperature Grade	OTHER	COMMERCIAL
Terminal Finish	Tin/Lead (Sn/Pb)
Terminal Form	BALL	BALL
Terminal Pitch	1 mm	1 mm
Terminal Position	BOTTOM	BOTTOM
Width	27 mm	27 mm
uPs/uCs/Peripheral ICs Type	MICROPROCESSOR	MICROPROCESSOR, RISC
Base Number Matches	1	1
	Microcontrollers and Processors » Microprocessors	Microcontrollers and Processors » Microprocessors