MPC8313ECZQAGDB vs MPC8313EVRAGDB feature comparison

MPC8313ECZQAGDB NXP Semiconductors

Buy Now Datasheet

MPC8313EVRAGDB Freescale Semiconductor

Buy Now Datasheet
Rohs Code No Yes
Part Life Cycle Code Active Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS FREESCALE SEMICONDUCTOR INC
Package Description 27 X 27 MM, 2.25 MM HEIGHT, 1 MM PITCH, TEPBGAII-516 27 X 27 MM, 2.25 MM HEIGHT, 1 MM PITCH, LEAD FREE, TEPBGAII-516
Reach Compliance Code unknown compliant
ECCN Code 3A991.A.2 5A002
HTS Code 8542.31.00.01 8542.31.00.01
Additional Feature ALSO REQUIRES 3.3V I/O SUPPLY ALSO REQUIRES 3.3V I/O SUPPLY
Address Bus Width 32 32
Bit Size 32 32
Boundary Scan YES YES
Clock Frequency-Max 66.67 MHz 66.67 MHz
External Data Bus Width 32 32
Format FLOATING POINT FLOATING POINT
Integrated Cache YES YES
JESD-30 Code S-PBGA-B516 S-PBGA-B516
JESD-609 Code e0 e2
Length 27 mm 27 mm
Low Power Mode YES YES
Number of Terminals 516 516
Operating Temperature-Max 105 °C 105 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code HBGA HBGA
Package Equivalence Code BGA516,26X26,40 BGA516,26X26,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, HEAT SINK/SLUG GRID ARRAY, HEAT SINK/SLUG
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.55 mm 2.55 mm
Speed 400 MHz 400 MHz
Supply Voltage-Max 1.5 V 1.5 V
Supply Voltage-Min 0.95 V 0.95 V
Supply Voltage-Nom 1 V 1 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL OTHER
Terminal Finish Tin/Lead (Sn/Pb) TIN SILVER
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 27 mm 27 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR MICROPROCESSOR
Base Number Matches 2 1
Part Package Code BGA
Pin Count 516
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 40

Compare MPC8313ECZQAGDB with alternatives

Compare MPC8313EVRAGDB with alternatives