MPC8313CVRAGDB
vs
MPC8250ACVRIFBX
feature comparison
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Obsolete
|
Transferred
|
Ihs Manufacturer |
FREESCALE SEMICONDUCTOR INC
|
FREESCALE SEMICONDUCTOR INC
|
Part Package Code |
BGA
|
BGA
|
Package Description |
27 X 27 MM, 2.25 MM HEIGHT, 1 MM PITCH, LEAD FREE, TEPBGAII-516
|
BGA,
|
Pin Count |
516
|
516
|
Reach Compliance Code |
compliant
|
unknown
|
ECCN Code |
5A992
|
3A991.A.2
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Additional Feature |
ALSO REQUIRES 3.3V I/O SUPPLY
|
ALSO REQUIRES 3.3V SUPPLY
|
Address Bus Width |
32
|
32
|
Bit Size |
32
|
32
|
Boundary Scan |
YES
|
YES
|
Clock Frequency-Max |
66.67 MHz
|
66.66 MHz
|
External Data Bus Width |
32
|
64
|
Format |
FLOATING POINT
|
FLOATING POINT
|
Integrated Cache |
YES
|
YES
|
JESD-30 Code |
S-PBGA-B516
|
S-PBGA-B516
|
JESD-609 Code |
e2
|
|
Length |
27 mm
|
27 mm
|
Low Power Mode |
YES
|
NO
|
Moisture Sensitivity Level |
3
|
|
Number of Terminals |
516
|
516
|
Operating Temperature-Max |
105 °C
|
70 °C
|
Operating Temperature-Min |
-40 °C
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
HBGA
|
BGA
|
Package Equivalence Code |
BGA516,26X26,40
|
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY, HEAT SINK/SLUG
|
GRID ARRAY
|
Peak Reflow Temperature (Cel) |
260
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
2.55 mm
|
2.55 mm
|
Speed |
400 MHz
|
200 MHz
|
Supply Voltage-Max |
1.5 V
|
1.9 V
|
Supply Voltage-Min |
0.95 V
|
1.7 V
|
Supply Voltage-Nom |
1 V
|
1.8 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
Terminal Finish |
TIN SILVER
|
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1 mm
|
1 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
40
|
|
Width |
27 mm
|
27 mm
|
uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR
|
MICROPROCESSOR, RISC
|
Base Number Matches |
1
|
1
|
|
|
|
Compare MPC8313CVRAGDB with alternatives
Compare MPC8250ACVRIFBX with alternatives