MPC8306SVMABDCA vs MPC8270CZQPKBX feature comparison

MPC8306SVMABDCA NXP Semiconductors

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MPC8270CZQPKBX Freescale Semiconductor

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Rohs Code Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer NXP SEMICONDUCTORS FREESCALE SEMICONDUCTOR INC
Package Description 19 X 19 MM, 1.61 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, MAPBGA-369 BGA,
Reach Compliance Code compliant unknown
ECCN Code 3A991.A.2 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Address Bus Width 32
Bit Size 32 32
Boundary Scan YES YES
Clock Frequency-Max 66.67 MHz 66.67 MHz
External Data Bus Width 64
Format FLOATING POINT FLOATING POINT
Integrated Cache YES YES
JESD-30 Code S-PBGA-B369 S-PBGA-B516
JESD-609 Code e2
Length 19 mm 27 mm
Low Power Mode YES NO
Moisture Sensitivity Level 3
Number of Terminals 369 516
Operating Temperature-Max 105 °C 70 °C
Operating Temperature-Min
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFBGA BGA
Package Equivalence Code BGA369,23X23,32
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.61 mm 2.55 mm
Speed 133 MHz 300 MHz
Supply Voltage-Max 1.05 V 1.6 V
Supply Voltage-Min 0.95 V 1.45 V
Supply Voltage-Nom 1 V 1.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER COMMERCIAL
Terminal Finish Tin/Silver (Sn/Ag)
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 40
Width 19 mm 27 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 2 2
Part Package Code BGA
Pin Count 516
Additional Feature ALSO REQUIRES 3.3V SUPPLY

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