MPC8306SVMABDCA
vs
MPC8270CVRPKBX
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
FREESCALE SEMICONDUCTOR INC
|
FREESCALE SEMICONDUCTOR INC
|
Part Package Code |
BGA
|
BGA
|
Package Description |
19 X 19 MM, 1.61 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, MAPBGA-369
|
BGA,
|
Pin Count |
369
|
516
|
Reach Compliance Code |
compliant
|
unknown
|
ECCN Code |
3A991.A.2
|
3A991.A.2
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Address Bus Width |
|
32
|
Bit Size |
32
|
32
|
Boundary Scan |
YES
|
YES
|
Clock Frequency-Max |
66.67 MHz
|
66.67 MHz
|
External Data Bus Width |
|
64
|
Format |
FLOATING POINT
|
FLOATING POINT
|
Integrated Cache |
YES
|
YES
|
JESD-30 Code |
S-PBGA-B369
|
S-PBGA-B516
|
JESD-609 Code |
e2
|
|
Length |
19 mm
|
27 mm
|
Low Power Mode |
YES
|
NO
|
Moisture Sensitivity Level |
3
|
|
Number of Terminals |
369
|
516
|
Operating Temperature-Max |
105 °C
|
70 °C
|
Operating Temperature-Min |
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
LFBGA
|
BGA
|
Package Equivalence Code |
BGA369,23X23,32
|
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY, LOW PROFILE, FINE PITCH
|
GRID ARRAY
|
Peak Reflow Temperature (Cel) |
260
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.61 mm
|
2.55 mm
|
Speed |
133 MHz
|
300 MHz
|
Supply Voltage-Max |
1.05 V
|
1.6 V
|
Supply Voltage-Min |
0.95 V
|
1.45 V
|
Supply Voltage-Nom |
1 V
|
1.5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
OTHER
|
COMMERCIAL
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
0.8 mm
|
1 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
40
|
|
Width |
19 mm
|
27 mm
|
uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
MICROPROCESSOR, RISC
|
Base Number Matches |
2
|
2
|
Additional Feature |
|
ALSO REQUIRES 3.3V SUPPLY
|
|
|
|
Compare MPC8306SVMABDCA with alternatives
Compare MPC8270CVRPKBX with alternatives